data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. 1 550 nm ingaasp mqw-dfb laser diode module 2.5 gb/s directly modulation light source for dwdm applications laser diode nx8563la series document no. pl10428ej02v0ds (2nd edition) date published september 2005 cp(k) printed in japan the mark ? shows major revised points. ? nec compound semiconductor devices, ltd. 2003, 2005 description the nx8563la series is a 1 550 nm multiple quantum well (mqw) structured distributed feed-back (dfb) laser di ode module with single mode fiber. it is designed as directly modulation light source and ideal for optical transmission systems. the device is av ailable for dense wavelength division multiplexing (dwdm) wavelengths based on itu-t recommendations, enabling a wide range of applications. features ? peak output power p f = 10 mw min. available for dwdm wavelengths based on itu-t recommendations (100 ghz grid, please refer to the ordering information ) internal thermo-electric cooler and isolator hermetically sealed 14-pin butterfly package single mode fiber pigtail wide operation temperature range
data sheet pl10428ej02v0ds 2 nx8563la series package dimensions (unit: mm) 29.970.25 7.80.2 5.4 5.15 0.3 1.0 top view 20.830.25 26.040.25 7 8 1 14 8.890.13 10 min. 15.24 20.8 12.70.2 6.0 0.9 1.25 2.54 0.5 4? 2.67 pd l + ? r ld #8 #14 #7 #1 optical fiber (smf) length: 1 000 min. cooler thermistor pin connections pin no. pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 function function thermistor thermistor bias pd anode pd cathode cooler anode cooler cathode gnd gnd gnd gnd, ld anode signal input gnd gnd optical fiber dimensions (unit: mm) parameter specification unit outer diameter 0.9 0.1 mm minimum fiber bending radius 30 mm fiber length 1 000 min. mm sc-upc fiber length: 1 000 mm min. 352 mm 8.990.5 mm smf sc-apc : cut angle 8
data sheet pl10428ej02v0ds 3 nx8563la series ordering information nx8563la - cd : sc-apc cc : sc-upc wavelength code : refer to table a without : 240 km (4 320 ps/nm) s : 100 km (1 800 ps/nm) table a: dwdm wavelength based on itu-t recommendations (@t ld = t set ) wavelength code itu-t wavel ength *1 frequency wavelength code itu-t wavel ength *1 frequency (nm) (thz) (nm) (thz) 303 1 530.33 195.90 509 1 550.91 193.30 311 1 531.11 195.80 517 1 551.72 193.20 318 1 531.89 195.70 525 1 552.52 193.10 326 1 532.68 195.60 533 1 553.32 193.00 334 1 533.46 195.50 541 1 554.13 192.90 342 1 534.25 195.40 549 1 554.94 192.80 350 1 535.03 195.30 557 1 555.74 192.70 358 1 535.82 195.20 565 1 556.55 192.60 366 1 536.60 195.10 573 1 557.36 192.50 373 1 537.39 195.00 581 1 558.17 192.40 381 1 538.18 194.90 589 1 558.98 192.30 389 1 538.97 194.80 597 1 559.79 192.20 397 1 539.76 194.70 606 1 560.60 192.10 405 1 540.55 194.60 614 1 561.41 192.00 413 1 541.34 194.50 421 1 542.14 194.40 429 1 542.93 194.30 437 1 543.73 194.20 445 1 544.52 194.10 453 1 545.32 194.00 461 1 546.11 193.90 469 1 546.91 193.80 477 1 547.71 193.70 485 1 548.51 193.60 493 1 549.31 193.50 501 1 550.11 193.40 *1 the value which omitted and computed t he 3rd place below the decimal point
data sheet pl10428ej02v0ds 4 nx8563la series absolute maximum ratings parameter symbol ratings unit forward current of ld i f 300 ma reverse voltage of ld v r 2.0 v forward current of pd i f 10 ma reverse voltage of pd v r 20 v operating case temperature t c ? 20 to +85 c storage temperature t stg ? 40 to +85 c lead soldering temperature t sld 260 (10 sec.) c electro-optical characteristics (t ld = t set , t c = ? 20 to +85 c) parameter symbol conditions min. typ. max. unit laser set temperature t set 30 45 c forward voltage v f p f = 10 mw 0.9 2.0 v threshold current i th 20 40 ma optical output power from fiber p f i f = i op , t ld = t set 10 mw operation current i op 125 ma threshold output power p th i f = i th 100 w quantum efficiency cw 0.142 0.17 w/a peak emission wavelength p p f = 10 mw, cw, t ld = t set 1 530 itu-t *1 1 562 nm spectral line width ? p f = 10 mw, cw, 3 db down 1 5 mhz side mode suppression ratio smsr p f = 10 mw, under modulation 30 35 db input impedance zin 25 ? relative intensity noise rin p f = 10 mw, 20 mhz to 3 ghz ? 140 db/hz rise and fall time t r /t f 20-80%/80-20%, t c = 25 c 120 ps f = 50 mhz to 3 ghz 6 input return loss s 11 f = 3 ghz to 6 ghz 3 db band width bw ? 3 db, p f = 10 mw 2.5 ghz dispersion penalty dp t c = 25 c *2 2.0 db *1 available for dwdm wavelengths based on itu-t recommendations (100 ghz grid, please refer to the ordering information ) *2 2.48832 gb/s, prbs 2 23 ? 1, duty cycle, extinction ratio 8.5 db, ber = 10 ? 10 , nx8563las: 1 800 ps/nm (100 km), nx8563la: 4 320 ps/nm (240 km)
data sheet pl10428ej02v0ds 5 nx8563la series electro-optical characteristics (applicable to monitor pd: t ld = t set , t c = ? 20 to +85 c) parameter symbol conditions min. typ. max. unit monitor current i m p f = 10 mw, v r = 5 v 100 2 000 a dark current i d v r = 5 v 10 na tracking error *1 i m = const. 0.6 db *1 = 10 log p f (mw) 0 i m i m t ld = t set , t c = 25?c t ld = t set , t c = ?20 to +85?c (@ p f (25?c) = 10 mw) 10 p f electro-optical characteristics (applicable to thermistor and tec: t ld = t set , t c = ? 20 to +85 c) parameter symbol conditions min. typ. max. unit thermistor resistance r t ld = 25 c 9.5 10.0 10.5 k ? b constant b 3 350 3 450 3 550 k cooler current i c ? t = 85 ? t set , p f = 10 mw 1.2 a cooler voltage v c ? t = 85 ? t set , p f = 10 mw 2.4 v p f 10 mw
data sheet pl10428ej02v0ds 6 nx8563la series reference document name document no. optical semiconductor devices for fiberoptic communications selection guide pl10161e opto-electronics devices pamphlet px10160e
data sheet pl10428ej02v0ds 7 nx8563la series when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of september, 2005. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product be fore using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0504 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1573 fax: +81-44-435-1579 for further information, please contact nx8563la series safety information on this product danger invisible laser radiation avoid direct exposure to beam output power mw max wavelength nm class lllb laser product semiconductor laser avoid exposure-invisible laser radiation is emitted from this aperture warning laser beam a laser beam is emitted from this diode during operation. the laser beam, visible or in visible, directly or indi rectly, may cause injury to the eye or loss of eyesight. do not look directly into the laser beam. avoid exposure to the laser beam, any reflected or collimated beam. caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth. caution optical fiber a glass-fiber is attached on the product. handle with care. when the fiber is broken or damaged, handle care fully to avoid injury from the damaged part or fragments.
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